Printed Electronics Lab

> R&D CENTER

Specializes in the development of process and equipment for the printed electronics industry
including OPV solar cell, OLED, lighting, smart ID, and others.

The technology and know-how gained from designing and building roll to roll converting machinery for over 55 years has led us to a leading role in this promising industry. Our goal is focused on system integration to support customers with coating / printing technology, high precision registration systems, and turnkey equipment for the printed electronics products industry.

SungAn Printed Electronics Lab.
SPEL for Printed Intelligence

SungAn Printed Electronics Laboratory specializes in developing process technology for various printed electronic applications such as organic photovoltaic (OPV), organic light emitting diode (OLED) lighting and others.

During the last decade, SPEL has been focused on developing the various fabrication processes, which is composed with printing, coating and drying technology including machine and control system.

The turn key system technology, with roll to roll based process and unique know-how of printing, coating and drying offers reliable mass production to whomever wants to start the flexible electronic business.

  • Current status of SPEL
  • Patents: 12 registered, 5 pending
  • Government Project: 4 completed, 3 ongoing
RCC Series
  • Hybrid system with coating and printing (slot die & rotary screen)
  • Easy expansion with modular process unit
  • Independent process control / particle, thermal and humidity control
  • Atmosphere independent drying / high align accuracy
  • Automated coating gap & width control
  • 2015 AIMCAL Technology of the Year Award
Applications
RSC-P Series
  • R2R based cylindrical bed flat screen printing system
  • High align accuracy with non-contact printing process (<±30 um)
  • Low operating tension deviation with motorized accumulator (<±0.1 kgf)
  • Long MTBF (Mean Time Between Failure) with zero-like clearance
  • High printing resolution
  • Long printing reliability
Applications
SSDC Series
  • Compact design for material and device structure research
  • Applicable to clean room and glove box
  • High efficiency of material usage
  • Easy process control with auto recipe management
  • Precise ink flow control
  • Closed ink delivery system for stable process of organic materials
Applications
Core technology of printed electronics
R2R based direct metal etching system
  • Applications
  • TCO, metal grid patterning NFC, RFID tag antenna TFT metal electrode
  • Precision pattern printing & registration: < 40um
  • Collaboration with “VTT, Technical Research Centre of Finland Ltd.”
  • VTT is the leading research and technology company in the Nordic countries. http://www.vtt.fi

Advantage of direct metal etching paste

Conventional wet etching process

R2R hybrid etching process (with etching paste)

Ultra high quality barrier film production system
  • Applications: High quality PE (OLED, OPV etc.) protection film
  • High speed & high quality barrier film production
  • High material usage efficiency
  • WVTR: 10-6g/m2·day
  • Substrate (≤200um): PEN, PET, etc.
  • Width of substrate: 300 mm
  • Process speed: 2 m/min
  • Deposition rate: 200 nm/min
  • Collaboration with “KIST, Korea Institute of Science and Technology”
  • KIST is the leading research institute in Republic of Korea. http://www.vtt.fi
Advantage of SAM’s ultra high barrier technology

Conventional barrier film tech

Increase moisture/

oxygen diffusion path length

  • Organic/Inorganic multilayer
  • : 4~5 barrier layer
  • Organic: Monomer mixture
  • Inorganic: Aluminum oxide
  • Method: Sputtering, non-conformal
    deposition

SAM’s barrier film tech

Reduce defect / pinhole of layer

  • Inorganic multilayer: 1 barrier layer,
  • 1 protection layer, 1 buffer layer
  • Organic: Monomer mixture
  • Method:

Research & Development project

    There is no registration data.